The XPH90 platform is cutting-edge technology designed to harness silicon-on-insulator (SOI) for photonics, integrating III-V materials for superior data transmission. It supports high-efficiency electro-optic modulators and state-of-the-art grating couplers. This platform is designed to meet the burgeoning requirements of high-speed data center communication, telecom, and LiDAR applications, thanks to its integration of various photonics devices. It offers multiple etch levels for enhanced optical performance and supports materials with high and low refractive indices for optimized coupling with III-V components.
