All IPs > Network on Chip > Network on Chip > Xinglian-700 High Scalability and Performance Interconnect Fabric
The Xinglian-700 is a highly scalable and efficient interconnect fabric IP developed by StarFive that offers excellent support for building expansive CPU and SoC architectures. Its design ensures memory consistency and offers high performance, making it suitable for sophisticated multi-core and SoC designs. This interconnect fabric is engineered to accommodate and synchronize a wide array of CPU cores, providing high-level integration solutions for modern electronic systems.
| Class | Value |
|---|---|
| Categories |
Network on Chip > Network on Chip |
| Availability | All Countries & Regions |
Join the world's most advanced semiconductor IP marketplace!
It's free, and you'll get all the tools you need to discover IP, meet vendors and manage your IP workflow!
No credit card or payment details required.
Join the world's most advanced AI-powered semiconductor IP marketplace!
It's free, and you'll get all the tools you need to advertise and discover semiconductor IP, keep up-to-date with the latest semiconductor news and more!
Plus we'll send you our free weekly report on the semiconductor industry and the latest IP launches!
To evaluate IP you need to be logged into a buyer profile. Select a profile below, or create a new buyer profile for your company.
To evaluate IP you need to be logged into a buyer profile. It's free to create a buyer profile for your company.
