The Universal Chiplet Interconnect Express (UCIe) by EXTOLL is a cutting-edge interconnect framework designed to revolutionize chip-to-chip communication within heterogeneous systems. This product exemplifies the shift towards chiplet architecture, a modular approach enabling enhanced performance and flexibility in semiconductor designs.
UCIe offers an open and customizable platform that supports a wide range of technology nodes, particularly excelling in the 12nm to 28nm range. This adaptability ensures it can meet the diverse needs of modern semiconductor applications, providing a bridge that enhances integration across various chiplet components. Such capabilities make it ideal for applications requiring high bandwidth and low latency.
The design of UCIe focuses on minimizing power consumption while maximizing data throughput, aligning with EXTOLL’s objective of delivering eco-efficient technology. It empowers manufacturers to forge robust connections between chiplets, allowing optimized performance and scalability in data-intensive environments like data centers and advanced consumer electronics.
