EXTOLL's Universal Chiplet Interconnect Express (UCIe) is a cutting-edge solution designed to meet the evolving needs of chip-to-chip communication. UCIe enables seamless data exchange between chiplets, fostering a new era of modular and scalable processor designs. This technology is especially vital for applications requiring high bandwidth and low latency in data transfer between different chip components.
Built to support heterogeneous integration, UCIe offers superior scalability and is compatible with a variety of process nodes, enabling easy adaptation to different technological requirements. This ensures that system architects can achieve optimal performance without compromising on design flexibility or efficiency. Furthermore, UCIe's design philosophy is centered around maintaining ultra-low power consumption, aligning with modern demands for energy-efficient technology.
Through EXTOLL’s UCIe, developers have the capability to build versatile and multi-functional platforms that are more robust than ever. This interconnect technology not only facilitates communications between chips but enhances the overall architecture, paving the way for future innovations in chiplet systems.
