The UCIe Chiplet Interconnect solution is a high-speed interface designed for efficient chip-to-chip and die-to-die communications within a SoC platform. This innovative interconnect adopts state-of-the-art technology to offer cross-chip bridging with support for AXI and CHI interfaces, ensuring seamless data transfer and integration between different chiplets.
With the ever-growing complexity of SoC designs, the UCIe Chiplet Interconnect ensures scalability and flexibility, adapting to a range of system configurations and technical requirements. It allows for a higher degree of customization, enabling developers to tailor the interconnect to fit specific design goals and application demands.
Beyond mere connectivity, the UCIe solution provides enhancements in power efficiency, reducing system power requirements while maintaining high data throughput. This solution is ideal for a wide range of applications, including high-performance computing and data centers, where it significantly optimizes the performance and connectivity of multi-chip systems.
