Terefilm Photopolymer stands out as an ingenious material solution for contemporary semiconductor challenges such as precision mass transfer, high-resolution photolithography, and transient bonding-debonding. Its exceptional patternability, clean decomposition, and minimal activation energy make it an optimal choice for high throughput semiconductor applications demanding strict control and hygiene.
The photopolymer offers thermal stability up to approximately 180°C before UV exposure, enabling its integration within processes that involve high-temperature steps. The subsequent application of low-energy UV irradiation notably reduces the decomposition temperature by over 100°C, significantly lessening the energy needed for vaporization. This transition is further facilitated by an acid catalyst, derived from commonly used photoacid generators in traditional photoresists, achieving complete vaporization within a sub-millisecond timescale.
Unlike typical high-energy light-decomposing materials, Terefilm is engineered to completely vaporize upon activation, leaving no carbon residue and removing the need for any elaborate cleaning processes post-decomposition. This characteristic ensures flawless component cleanliness and aligns with high precision placement applications where controlled spatial decomposition is critical.
The utility of Terefilm Photopolymer is extensive, especially within Laser Induced Forward Transfer (LIFT) processes, where precise material decomposition and low fluence photomasking are vital. Its unique design supports the selective die release and pitch conversion, facilitating the reliable and accurate composite placement.
