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All IPs > Memory & Logic Library > Embedded Memories > SuperFlash® Technology

SuperFlash® Technology

From Silicon Storage Technology, Inc.

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Description

SuperFlash® Technology stands out as a cost-effective and high-performance solution, utilizing a proprietary split-gate Flash memory cell. It provides exceptional programmability for System-on-Chip (SoC) applications. Renowned for its reliability, SuperFlash® technology has been in production for over two decades, ensuring robust solutions for industries such as automotive, IoT, AI, and secure smart cards. Its impressive endurance, excellent data retention, and resilience to high temperatures make it an optimal choice for demanding environments.

The architecture simplifies the design process while maintaining compatibility with standard silicon CMOS processes, extending scalability from larger nodes down to 110 nm technology. Its immunity to Stress-induced Leakage Current (SILC) enhances its reliability further. Available through flexible licensing options, SuperFlash® technology is employed by leading foundries and Integrated Device Manufacturers worldwide.

This technology's availability spans a broad range of process nodes, from 28 nm to 500 nm, ensuring wide applicability in next-generation memory solutions. SuperFlash®'s impressive track record with over 90 billion units shipped underscores its innovation and reliability in the market.

Features
  • High endurance
  • Low power
  • Standard silicon CMOS compatibility
  • Excellent data retention
Foundries & Process Nodes
Foundry Process Nodes
HHGrace 130nm
Renesas 130nm
Samsung 28nm
55nm
TSMC 22nm
40nm
130nm
180nm
Tech Specs
Applications
  • Automotive
  • IoT
  • Smart cards
  • AI applications
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