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All IPs > Memory & Logic Library > Embedded Memories > ReRAM IP Cores for High-Density Data Storage

ReRAM IP Cores for High-Density Data Storage

From CrossBar Inc.

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Description

CrossBar's ReRAM IP Cores offer cutting-edge solutions for high-density data storage applications, enabling terabytes of storage in compact, efficient chips. These cores utilize CrossBar's unique ReRAM technology, renowned for its scalability and ease of integration within advanced semiconductor processes, facilitating substantial memory advancements in sectors ranging from data centers to consumer electronics.

Designed for stackable architectures, these high-density memory solutions allow for integration of both logic and memory onto a single chip. This innovative design reduces complexity and enhances performance, making it suitable for demanding applications that require robust storage capabilities. The ReRAM technology offers significantly better endurance and write/read speeds than traditional memory options, alongside lower energy consumption, promoting more efficient system designs.

Furthermore, CrossBar's ReRAM cores ensure superior data integrity and reliability, essential for both consumer and industrial applications. They provide a strong foundation for next-generation storage solutions where rapid access to large volumes of data is a critical factor. The technology's resilience to environmental conditions and its adaptability across various fab processes make it a versatile and dependable choice for high-volume storage needs.

Features
  • Stackable 3D architecture
  • High endurance and speed
  • Efficient energy consumption
Foundries & Process Nodes
Foundry Process Nodes
TSMC All Process Nodes
Tech Specs
Applications
  • Data Centers
  • High-Performance Computing
  • Consumer Electronics
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