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All IPs > Memory & Logic Library > Embedded Memories > ReRAM IP Cores for High-Density Data Storage

ReRAM IP Cores for High-Density Data Storage

From CrossBar Inc.

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Description

Targeting the new demands of data-heavy applications, CrossBar's ReRAM IP Cores for High-Density Data Storage deliver unparalleled performance for high-capacity memory applications. These IP cores are crafted to meet the rigorous requirements of storage-intensive environments such as data centers, mobile computing, and artificial intelligence systems, providing a high-density, low-latency memory solution that exceeds the capabilities of traditional storage technologies.

The High-Density Data Storage Cores leverage 3D stacking capability, which allows CrossBar to enhance storage capacity significantly, reaching up to 1TB NV-DIMM configurations with superior read performance and power efficiency. This makes them highly advantageous for large-scale data operations requiring rapid access times and robust storage solutions.

CrossBar's technology is versatile and supports various advanced semiconductor processes, enabling customization and architectural flexibility to meet specific application needs. These cores not only bolster performance and reduce power consumption but also support secure PUF key deployment for applications where data security is of paramount importance. The versatility and advanced features of these cores are crafted to empower the next generation of data storage solutions.

Features
  • 3D stacking
  • High-density storage
  • Low power consumption
Foundries & Process Nodes
Foundry Process Nodes
TSMC 12nm
14nm
20nm
28nm
Tech Specs
Applications
  • Data Centers
  • Mobile Computing
  • AI Systems
  • Consumer Electronics
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