The CurrentRF PowerPad is an innovative embedded technology designed to integrate with power and ground bondpad overlays. This Dynamic Power Reduction IP serves to minimize IC area increase when incorporated, while effectively managing power distribution. The PowerPad dynamically mitigates circuit power losses by replacing traditional IC power and ground bondpads, contributing to a more efficient usage of energy within the circuit. This IP is particularly beneficial for applications where conserving space without compromising on performance is critical.
