The NuLink Die-to-Memory PHY products are exemplars of Eliyan’s innovative approach to overcoming traditional memory bandwidth limitations. These solutions provide critical interconnectivity between die and memory components within standard packaging frameworks, promoting both low power consumption and high throughput. These PHYs are strategically designed to complement diverse memory configurations, thereby enhancing overall system performance.
Unlike fixed-direction interconnect options, Eliyan's NuLink technology supports dynamic communication with bidirectional capabilities. This allows an efficient balance between power savings and robust performance outcomes, while seamlessly integrating into existing package formats to maintain standardization and economic efficiencies.
An alignment with industry standards, such as UCIe, underscores the NuLink Die-to-Memory solutions' versatility and adaptability across different sectors. Their dynamic capabilities make them ideal for applications that demand high-density, speed-sensitive memory interactions, providing an essential tool in the engineering of powerful, multi-die assemblies with optimized thermal and cost profiles.
