Eliyan's NuLink Die-to-Memory PHY is engineered to optimize memory interfaces within multi-chip systems, enhancing bandwidth and reducing latency between processing units and memory. Targeted at advanced computing applications, these PHY products leverage a standard interfacing approach to maintain compatibility while pushing the boundaries of performance, especially critical in data-intensive tasks like AI and machine learning.
The PHY design supports a high degree of modularity, facilitating easy integration into systems with varying requirements, from HPC to embedded processing environments. Operating seamlessly across both standard and advanced packaging environments, it offers significant improvements over traditional memory interconnects, including substantial power savings and thermal efficiency, key considerations in the design of modern semiconductor devices.
Designed to meet the performance demands of future applications, the NuLink Die-to-Memory PHY supports broad on-chip data exchange, crucial for fast and efficient communication between multi-core processors and memory modules. This results in a scalable, high-throughput interconnect capable of future-proofing technological investments against advancing data processing demands.
