Designed for aiding seamless integration with memory systems, Eliyan's NuLink Die-to-Memory PHY products provide robust solutions for breaking the memory wall in high-performance computing and AI systems. These PHY products advocate the use of simultaneous bidirectional (SBD) signaling, improving efficiency by allowing data to be transmitted and received simultaneously, doubling the bandwidth capacity instantly. NuLink technology excels in configuring lanes for unidirectional and half-duplex bidirectional signaling, all on standard organic packaging with bump pitches starting at 90um. Eliyan's NuLink PHY expands memory bandwidth without necessitating advanced packaging like silicon interposers, making it a cost-effective solution for implementing universal memory interfaces. These interfaces further enhance interoperability across various memory types and settings, ensuring superior performance and flexibility.
