This silicon-proven Wirebond compatible library in Dongbu HiTek 110nm features a multi-voltage, multi-standard General
Purpose Input Output with an Open-Drain Input Output capability, that targets the I2C standard. The library is built as a Fail-
Safe I/O design. There is no poly-orientation for this library. The library features an Analog Mux, which allows for core direct
access to the bondpad, either to drive externally a signal or receive a signal from the PAD. The I/O Library is compliant with
standards regarding all 1.2V, 1.8V, and 3.3V operation. The library can support various standards, including I3C, I2C, SPI
and QSPI. ESD targets are 2kV HMB and 500V CDM.
