Metis stands at the forefront of IC packaging innovation, specializing in electromagnetic solutions for multi-die 2.5D/3D designs. This tool addresses the growing complexity in IC packaging by offering exhaustive capabilities for signal integrity and power integrity analysis.
It supports large-scale simulations that are crucial for modern semiconductor applications, where multi-die configurations are becoming increasingly common. By facilitating comprehensive electromagnetic analysis, Metis ensures that designers can efficiently manage signal pathways and mitigate interference effects.
Metis is equipped with advanced simulation engines that can handle the demanding computational requirements of large IC packages, offering designers the precision needed to optimize performance across a range of scenarios. Its utility in complex design environments makes it a vital component in broader development strategies for cutting-edge semiconductor technology.
