Metis offers a powerful electromagnetic (EM) solver specifically designed for large-capacity simulations necessary in 2.5D and 3D integrated circuit (IC) packaging. This platform addresses the growing complexity in multi-die packaging, providing engineers with tools to analyze and optimize signal and power integrity across intricate package designs.
By simulating the electromagnetic properties of multi-die systems, Metis aids in the assessment of inter-die signal transmission and power distribution, crucial for maintaining system integrity in modern IC packages. Its capabilities extend to analyzing thermal and stress impacts, which are increasingly prevalent as package densities rise.
Capable of handling large data sets and complex package architectures, Metis empowers engineers to deliver robust designs that fulfill the stringent requirements of high-performance computing and advanced communication systems. It integrates easily into existing workflows, providing the versatility needed to address both current and future packaging challenges.
