The LEE Fuse ZA is a specialized Anti-Fuse memory solution, optimized for one-time programming needs such as memory redundancy and trimming applications. Its design philosophy embraces ease of implementation and cost effectiveness, requiring no additional masks or process steps beyond standard CMOS workflows.
With capabilities extending from advanced nodes of sub-10nm to more classic 180nm processes, this memory is versatile across various technology scales. The LEE Fuse ZA stands out due to its high-temperature and long data retention attributes, aligned with the demands of automotive-grade applications.
Its efficient design supports widespread application opportunities, enabling manufacturers to integrate this technology into existing systems without significant architectural overhaul. LEE Fuse ZA addresses critical memory needs while maintaining cost efficiency and reliability in challenging environments.