Hermes Layered offers advanced 3D finite element method (FEM) simulation capabilities, crucial for developments in integrated circuit (IC), package, and printed circuit board (PCB) designs. The tool provides detailed electromagnetic analysis, enabling users to refine and optimize their designs against a range of performance criteria.
Engineers benefit from its capability to model and simulate layered structures, a common feature in modern electronic designs, which allows for comprehensive analysis of electromagnetic interactions. This ensures robustness against performance anomalies, such as signal reflection and impedance mismatches, common in high-speed applications.
Hermes Layered supports a wide range of simulations, including 3D circuit structures and antenna design, making it integral for industries pushing the boundaries on miniaturization and performance. Its versatility ensures engineers can address specific design challenges, enhancing productivity and ensuring high-quality design outcomes in today’s tech-driven environment.
