Hermes 3D specializes in the simulation of arbitrary 3D structures, essential for high-precision designs in semiconductors and advanced electronics. The tool provides an expansive suite of 3D simulation capabilities that cater to complex design requirements, offering insights into electromagnetic properties that influence design outcomes.
Through its robust FEM-based simulation engines, Hermes 3D facilitates comprehensive analysis of custom structures applicable in next-gen IC, PCB, and electronic packaging designs. Engineers can model the electromagnetic interactions within these structures, managing challenges such as signal integrity and power distribution in compact design layouts.
Hermes 3D stands out for its ability to support diverse applications, from high-frequency component design to novel electronic interfaces, allowing innovation in fields such as telecommunications, computing, and consumer electronics. By providing meticulous control over simulation parameters, it ensures the development of designs that are both innovative and market-ready.
