FlexNoC Interconnect is renowned for its ability to enable developers to create high-throughput, physically aware network-on-chip (NoC) solutions quicker than traditional methods. Integrated with physical awareness technology, it significantly reduces interconnect area and power consumption, giving place and route teams a superior starting point. By leveraging source-synchronous communications and virtual channels, FlexNoC supports vast chip paths, streamlining the process and enhancing performance.
Facilitated by a set of intuitive underlying algorithms, FlexNoC helps construct any topology, thus addressing diverse SoC demands ranging from small to large-scale applications. This flexibility allows for substantial bandwidth, efficiently managing on-chip data flow and facilitating quick access to off-chip memory. Through its rapid installation capabilities and integrated physical awareness, it provides a five times faster resolution cycle time compared to manual approaches.
FlexNoC's unique efficiencies contribute to market differentiation by optimizing cache coherence, communication fluidity, and comprehensive integration, thus accelerating product time-to-market. Its implementation in ASIC design ensures combined performance optimization, scalability, and system integration, meeting the rigorous demands of modern computing technologies, particularly in automotive, consumer electronics, and industry sectors.
