The FlexNoC Interconnect is engineered as a physically-aware network-on-chip (NoC) IP that serves as the backbone of semiconductor solutions in high-demand markets. It assists SoC developers in creating quick, reliable network setups with minimal power consumption. By incorporating top-grade algorithms and a user-friendly interface, FlexNoC facilitates flexible and efficient interconnect designs for both small and large-scale SoCs.
Featuring robust support for comprehensive topologies, FlexNoC is highly advantageous in navigating the complexities of long interchip pathways using virtual channels and synchronous communications. It supports multi-channel memory such as HBMx, ensuring outstanding bandwidth and seamless off-chip memory access. The IP’s physical awareness advances timing closure processes and reduces interconnect area, contributing to reduced power usage and enhanced scalability.
Designed for wide application across automotive, consumer electronics, and industrial sectors, FlexNoC offers standard protocol interoperability and advanced power management with state-of-the-art security measures. The IP’s ability to maintain high frequencies and lower latencies while ensuring compact die areas makes it indispensable for projects aiming for time-efficient delivery and market distinction.
