The E-DIP Integrated Diplexer represents a cutting-edge advance in the miniaturization of E-band communication components. It is crafted to provide high performance in a small footprint, notably being recognized as the world's smallest commercially available E-band diplexer. Its design, which is executed on a BT laminate substrate and compatible with plastic IC packaging, reflects Multifractal Semiconductors' expertise in merging high performance with economic manufacturing processes.
This diplexer is equipped with impressive out-of-band suppression capabilities exceeding 60 dB, and features an attractive insertion loss of 3.5 dB, including transitions, making it a powerful component for systems where efficiency and signal integrity are critical. Its compact form-factor, measuring just 3.8 x 4.5 mm, ensures easy integration into modern packaging forms like FCCSP, BGA, CSP, and SiP, reinforcing its practicality for widespread deployment.
Incorporating the E-DIP into communication systems promises enhanced signal processing and separation, facilitating superior system performance and reliability. This makes it indispensable for advanced communication applications seeking to leverage innovative diplexer technology in compact and efficient modules.
