The E-DIP Integrated Diplexer represents a groundbreaking advancement in the miniaturization of E-band components. Designed with an eye towards space efficiency and performance, this product emerges as the smallest commercially available E-band diplexer on the market. It's constructed on a BT laminate substrate, tailored to be compatible with a variety of plastic IC packaging formats such as FCCSP, BGA, CSP, and SiP.
This diplexer excels with its diminutive 3.8 x 4.5 mm form factor, which does not come at the expense of performance. It offers exceptional out-of-band suppression exceeding 60 dB, coupled with an attractive insertion loss of just 3.5 dB, IC transitions included, making it a premier choice for applications needing both high precision and efficiency.
The E-DIP’s ability to tightly integrate within systems designed for next-generation MIMO arrays underscores its flexibility and performance reliability. This product is perfectly suited for telecommunications environments focusing on scalability and high-frequency operability, aligning with both current and future technical demands.
