AresCORE is a revolutionary PHY designed for UCIe (Universal Chiplet Interconnect Express) die-to-die connections, offering ultra-low power and latency solutions for connecting chips within the same package. This innovative PHY supports significant bandwidth capabilities, making it an ideal choice for performance-driven applications such as AI, HPC, and advanced computing. The design ensures minimal energy consumption while maintaining exceptional throughputs, allowing for efficient data routes between dies.
One of the notable features of AresCORE is its compatibility with the latest inter-die communication standards, ensuring it meets current and emerging requirements for high-speed connectivity. It employs advanced signaling techniques to prevent data loss and ensure consistent throughput even under extensive usage scenarios.
Its ability to integrate seamlessly into next-gen chiplet structures allows manufacturers to utilize AresCORE for a variety of platform-specific applications, supporting both bandwidth-intensive and power-sensitive projects. As devices become more heterogeneous, AresCORE positions itself as a critical component facilitating robust, intra-package communication and promoting scalability in electronic product designs.
