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All IPs > Memory & Logic Library > I/O Library > A Wirebond and FlipChip compatible <80fF ESD Solutions for Multi-Gigabit SerDes Applications.

A Wirebond and FlipChip compatible <80fF ESD Solutions for Multi-Gigabit SerDes Applications.

From Certus Semiconductor

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Description

This silicon-proven TSMC 28nm Digital I/O Library delivers a low-capacitance, high-reliability interface solution optimized
for advanced semiconductor applications. Featuring low-capacitance LVDS differential pairs (<250fF per pin) at 0.8V, this
library ensures superior signal integrity for high-speed applications. The I/O macro seamlessly integrates with the TSMC
1.0V I/O Library, sharing a compatible VDDA and VSSA bus structure for streamlined power management. Designed with a
14-bondpad ESD macro, including two differential pairs and dedicated power/ground cells, it provides a robust 0.8V VDDA
power domain with a 0V ground reference. Engineered for reliability, the library avoids minimum-width metal traces and
adheres to enhanced via/contact recommendations for long-term durability. With Cadence OA database compatibility, the
library supports Spectre and auCdl views, enabling seamless simulation, LVS verification, and integration into standard
design flows.

Deliverables
Hard IP
  • Verilog
  • GDS
  • LEF/DEF
  • Datasheet
  • Integration guide
Foundries & Process Nodes
Foundry Process Nodes
TSMC 28nm
Tech Specs
Class Value
Categories Memory & Logic Library > I/O Library
PDK Version Various
Silicon Validated YES
In Production? YES
Key I/O Standards 1kV to 4kV Low Cap ESD for high-speed Serdes and RF applications
Availability All Countries & Regions
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