All IPs > Interface Controller & PHY > D2D
Device-to-Device (D2D) communication is a critical component in modern electronics, enabling direct interaction between devices without intermediary network infrastructure. Within our Interface Controller & PHY category, the D2D segment offers specialized semiconductor IPs designed to streamline and enhance these direct connections. These IPs are indispensable in creating an efficient communication link that can handle the increasing data demands seen in consumer electronics, automotive systems, and IoT devices.
Our D2D semiconductor IPs consist of essential building blocks such as interface controllers and Physical Layer (PHY) IP cores. These components are engineered to facilitate seamless communication between devices, whether it be for transferring data, synchronizing functions, or sharing resources in real-time. By leveraging these IPs, manufacturers can achieve low latency, high-speed data transfer, and robust connectivity, making these components suitable for applications requiring precise and rapid interaction.
Incorporating D2D IPs into your design allows for efficient use of bandwidth and power, critical factors in battery-operated or compact devices. The versatility of these semiconductor IPs makes them a popular choice in developing smart home devices, wearables, and vehicle infotainment systems, where direct and reliable device-to-device communication is paramount. These IPs also help minimize reliance on external network structures, providing a more secure and localized network environment.
The D2D interface controller and PHY IPs in our collection are developed to cater to the demanding needs of modern technological solutions. Whether you are designing a new IoT ecosystem or enhancing an automobile's connectivity suite, selecting the right D2D IP core can significantly impact your product’s performance and user experience. Explore our offerings to find the IP solutions that best align with your innovation goals, ensuring your devices communicate effectively and efficiently.
The CXL 3.1 Switch by Panmnesia is a high-tech solution designed to manage diverse CXL devices within a cache-coherent system, minimizing latency through its proprietary low-latency CXL IP. This switch supports a scalable and flexible architecture, offering multi-level switching and port-based routing capabilities that allow expansive system configurations to meet various application demands. It is engineered to connect system devices such as CPUs, GPUs, and memory modules, ideal for constructing large-scale systems tailored to specific needs.
The CT25205 is a comprehensive digital controller designed for 10BASE-T1S Ethernet applications, providing seamless integration with Ethernet MACs and offering essential PMA, PCS, and PLCA Reconciliation Sublayer components. Crafted in Verilog 2005 HDL, this core is fully synthesizable on standard cells and FPGA systems, ensuring versatile deployment in various network architectures. The IP also supports PLCA RS, enabling advanced Ethernet features without the need for additional MAC extensions. It's developed to function with the OPEN Alliance 10BASE-T1S PMD interface, making it a robust solution for modern Ethernet-based systems.
The NuLink Die-to-Die PHY is a state-of-the-art IP solution designed to facilitate efficient die-to-die communication on standard organic/laminate packaging. It supports multiple industry standards, including UCIe and Bunch of Wires (BoW) protocols, and features advanced bidirectional signaling capabilities to enhance data transfer rates. The NuLink technology enables exceptional performance, power economy, and reduced area footprint, which elevates its utility in AI applications and complex chiplet systems. A unique feature of this PHY is its simultaneous bidirectional signaling (SBD), that allows data to be sent and received simultaneously on the same physical line, effectively doubling the available bandwidth. This capacity is crucial for applications needing high interconnect performance, such as AI training or inference workloads, without requiring advanced packaging techniques like silicon interposers. The PHY's design supports 64 data lanes configured for optimal placement and bump map layout. With a focus on power efficiency, the NuLink achieves competitive performance metrics even in standard packaging, making it particularly suitable for high-density systems-in-package solutions.
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of your UCIe designs. MAXVY UCIe VIP is fully compliant with UCIe Specification version 1.0 and supports all the layers of the UCIe stack, such as FDI, RDI, LogPHY, PCIe, and CXL protocols. MAXVY UCIe VIP is also very user-friendly and flexible, with simple APIs, easy integrations, and configurable parameters. You can easily customize and control the UCIe functionality according to your needs. MAXVY UCIe VIP also provides a rich set of verification capabilities, such as protocol checks, functional coverage, traffic generation, error injection, and debug tools. You can easily monitor, detect, and report any issues or violations in your UCIe designs. MAXVY UCIe VIP is compatible with the industry-standard Universal Verification Methodology (UVM) and supports all leading simulators. With MAXVY UCIe VIP, very flexible for unit level testing, you can achieve faster verification closure and higher quality of your UCIe designs.
YouSerdes provides a versatile high-speed serial data interface, supporting multiple data rates ranging from 2.5Gbps to 32Gbps. It integrates multiple SERDES channels, ensuring it delivers top-tier performance, area efficiency, and power consumption relative to its peers in the market. It's ideal for applications requiring robust, high-speed data communication.
YouSerdes provides a versatile high-speed serial data interface, supporting multiple data rates ranging from 2.5Gbps to 32Gbps. It integrates multiple SERDES channels, ensuring it delivers top-tier performance, area efficiency, and power consumption relative to its peers in the market. It's ideal for applications requiring robust, high-speed data communication.
The ePHY-5616 is a high-performance SerDes solution from eTopus, designed for versatile use across enterprise, data center, and 5G applications. Operating efficiently at data rates from 1 to 56 Gbps, this product exploits advanced DSP techniques for superior signal integrity and robustness. It accommodates wide insertion loss ranges of 10dB to over 35dB, thus ensuring reliable performance in challenging communication environments. Its architecture supports direct optical drives and quad/octal configurations, making it ideal for network interface cards, routers, and high-speed switches in a data center setup. The embedded DSP architecture is developed with eTopus's proprietary algorithms, which enable rapid SerDes tuning and performance optimization. The ePHY-5616 is also characterized by its low Bit Error Rate (BER), ensuring data reliability and integrity. Moreover, it supports multiple protocols, including Ethernet and PCIe, enhancing its integration potential in modern broadband networks.
The Universal Chiplet Interconnect Express (UCIe) by Extoll exemplifies a transformative approach towards interconnect technology, underpinning the age of chiplets with a robust framework for high-speed data exchange. This innovative solution caters to the growing demands of heterogeneous integration, providing a standardized protocol that empowers seamless communication between various chiplet designs. UCIe stands out by offering unparalleled connectivity and interoperability, ensuring that diverse chiplet systems function cohesively. This interconnect solution is tailored to the needs of modern digital architectures, emphasizing adaptability and performance across different tech nodes. With Extoll’s mastery in digital-centric design, the UCIe provides an efficient gateway for integrating multiple technological processes into a singular framework. The development of UCIe is also driven by the need for solutions that are both energy and cost-efficient. By leveraging Extoll’s low power architecture, UCIe facilitates energy savings without compromising on speed and data integrity. This makes it an indispensable tool for entities that prioritize scalable, high-performance interconnection solutions, aligning with the semiconductor industry's move toward more modular and sustainable system architectures.
Wormhole is a high-efficiency processor designed to handle intensive AI processing tasks. Featuring an advanced architecture, it significantly accelerates AI workload execution, making it a key component for developers looking to optimize their AI applications. Wormhole supports an expansive range of AI models and frameworks, enabling seamless adaptation and deployment across various platforms. The processor’s architecture is characterized by high core counts and integrated system interfaces that facilitate rapid data movement and processing. This ensures that Wormhole can handle both single and multi-user environments effectively, especially in scenarios that demand extensive computational resources. The seamless connectivity supports vast memory pooling and distributed processing, enhancing AI application performance and scalability. Wormhole’s full integration with Tenstorrent’s open-source ecosystem further amplifies its utility, providing developers with the tools to fully leverage the processor’s capabilities. This integration facilitates optimized ML workflows and supports continuous enhancement through community contributions, making Wormhole a forward-thinking solution for cutting-edge AI development.
SkyeChip's Die-to-Die (D2D) Interconnect provides streamlined connectivity solutions for chips utilizing advanced packaging techniques. It offers lightweight, high-performance links that comply with the latest UCIe standards, supporting myriad protocols including PCIe and CXL. The D2D Interconnect emphasizes optimal performance with minimal power and area overhead by integrating built-in self-test and repair functionalities to ensure yield preservation. Its architecture is designed for high-speed data transfer rates up to 32 Gbps/pin, crucial for applications involved in intensive data throughput. The solution supports 2.5D and standard packaging technologies, allowing broad applicability in various modern semiconductor architectures. This interconnect is essential for system designers focusing on maximizing communication efficiency across ICs in sophisticated multi-die designs.
The ARINC 818 Streaming solution is engineered to provide unrivaled real-time streaming conversion between a pixel bus and ARINC 818 formatted serial data streams. This solution allows seamless transition from traditional pixel data to advanced ARINC standards, facilitating comprehensive image and data transmissions across avionics systems. This solution is crucial for systems requiring high-performance graphic data management, maximizing efficiency in data handling while maintaining impeccable integrity of transmitted streams. Its processing efficiency ensures minimized latency, which is pivotal for real-time operations where timing accuracy is non-negotiable. Serving the demanding requirements of avionics communication platforms, this core manages intricate data flows effortlessly. The ARINC 818 Streaming solution embodies a tradition of excellence in data management, tailored to bolster the capabilities of aviation systems with its adept data transformation properties.
The High-Speed SerDes solution by Extoll is engineered to propel chiplet-based technologies into the future. This interconnect technology is integral for creating scalable systems that boast low power consumption and high-speed data transfer, essential for modern ASIC designs. Its architecture leverages digital-oriented design principles to optimize performance and energy efficiency, making it an ideal choice for heterogeneous integration applications. The collaboration with industry leaders like BeammWave and GlobalFoundries underscores its reliability and industry relevance, particularly in addressing the demands for minimal power expenditure in high-speed applications. Built on top-tier process technologies, Extoll’s High-Speed SerDes offers an unparalleled level of integration, ensuring rapid and efficient data communication between chiplets. This product is pivotal for the development of next-generation systems that require seamless interaction and data throughput at various integration scales. Moreover, its design accommodates a flexible range of tech nodes, enhancing its applicability across various platforms and products. Beyond its core function in high-speed data transfer, the High-Speed SerDes is also equipped to handle rigorous demands made by modern networks. It addresses the growing need for interconnect solutions capable of maintaining integrity and performance under high-load conditions, cementing its role as a foundational element in the semiconductor industry's shift towards innovative interconnection models.
The ARINC 818 Direct Memory Access (DMA) component provides a thorough hardware IP solution tailored for the transmission and reception of the ARINC 818 protocol. Engineered for use in embedded systems applications, it optimizes formatting, timing, and buffer management, crucial for maintaining seamless operations. This core takes significant responsibilities off the main processor, boosting efficiency across embedded environments by handling demanding protocol requirements robustly. Its architecture is optimized to enhance embedded application performance, promoting smooth and efficient interactions between diverse system components. Critical for protocol offloading, this solution delivers substantial improvements in processing times and data management within advanced communication infrastructures. The ARINC 818 DMA is essential for systems faced with complex data engagements, ensuring resource maximization without compromise on performance or reliability.
The APIX3 transmitter and receiver modules represent Inova Semiconductors' cutting-edge advancement in automotive multimedia innovation. Highlighting its versatility, APIX3 is developed to meet the rigorous demands of modern infotainment systems and premium cockpit architectures, supporting data rates up to 12 Gbps when utilizing quad twisted pair cabling. This provides high-resolution display connections, ideal for ultra-high-definition video applications within vehicles. Engineered for future scalability, APIX3 modules enable multiple video channels to traverse a singular connection, adhering to cost-effective implementations while maintaining high-performance standards. Compatibility extends to Ethernet technologies, ensuring seamless integration into existing vehicle communication systems and infrastructures, fostering more connected and smarter vehicles. The APIX3 infrastructure also features advanced diagnostic capabilities which foresee potential cable issues, accommodation through active equalizers that automatically adjust to transmission paths, and temperature adaptations. Such features significantly reduce maintenance needs, avoiding unplanned service interruptions, and contributing to safe, reliable data transmission.
eTopus's ePHY-11207 stands out in their SerDes lineup by achieving data rates up to 112 Gbps, a leap forward for scenarios demanding ultra-high bandwidth and low-latency communication. Constructed on a 7nm platform, this product is tailored for state-of-the-art applications in both enterprise and advanced data center environments. The architecture of the ePHY-11207 is conducive to handling extensive insertion loss ranges and high-sensitivity demands typical of contemporary optical and copper interconnects. Its adaptability is further enhanced by embedded proprietary DSP algorithms that permit fine-tuning of performance in sub-millisecond timeframes, a feature that assures operational stability even amidst jitter-inducing environments. In addition to backing numerous protocols such as Ethernet and PCIe, the ePHY-11207's low BER and extensive diagnostic capabilities make it a prime candidate for rapid deployment in high-density network settings. Such versatility not only supports robust infrastructure but also enhances overall throughput efficiency.
The BlueLynx Chiplet Interconnect is a sophisticated die-to-die interconnect solution that offers industry-leading performance and flexibility for both advanced and conventional packaging applications. As an adaptable subsystem, BlueLynx supports the integration of Universal Chiplet Interconnect Express (UCIe) as well as Bunch of Wires (BoW) standards, facilitating high bandwidth capabilities essential for contemporary chip designs.\n\nBlueLynx IP emphasizes seamless connectivity to on-die buses and network-on-chip (NoCs) using standards such as AMBA, AXI, and ACE among others, thereby accelerating the design process from system-on-chip (SoC) architectures to chiplet-based designs. This innovative approach not only allows for faster deployment but also mitigates development risks through a predictable and silicon-friendly design process with comprehensive support for rapid first-pass silicon success.\n\nWith BlueLynx, designers can take advantage of a highly optimized performance per watt, offering customizable configurations tailored to specific application needs across various markets like AI, high-performance computing, and mobile technologies. The IP is crafted to deliver outstanding bandwidth density and energy efficiency, bridging the requirements of advanced nodal technologies with compatibility across several foundries, ensuring extensive applicability and cost-effectiveness for diverse semiconductor solutions.
Facilitate inter-chip communication within your AMD Zynq 7000 All Programmable SoC designs with the logiSPI IP core. It serves as a bridge between the Serial Peripheral Interface (SPI) and AXI4, simplifying the integration of various MCU components into your systems. This module is indispensable for ensuring smooth, reliable interfacing between digital devices in complex circuit designs.
The CXL 3.0 solution from Rapid Silicon is an advanced Controller IP designed to enhance your FPGA design with superior performance and flexibility. This IP is compliant with CXL specifications up to version 3.0, along with support for earlier versions 2.0, 1.1, and 1.0. It offers seamless integration capabilities with PCIe, standing up to PCIe 6.0 and ensuring backward compatibility. The architecture of the CXL Controller IP is highly configurable, providing adaptability for specific application requirements, including lane configurations, datapath widths, and efficiency in power management. One of the standout features of the CXL 3.0 IP is its support for advanced functionalities such as lane bonding, multicast, and robust error correction mechanisms. These features ensure the IP delivers reliable and efficient performance in diverse environments. Ideal for critical data-intensive tasks, the IP is suited for telecommunications, industrial applications, and more, where data throughput and protocol bridging are crucial. With its focus on delivering unmatched speed, efficiency, and scalability, the CXL 3.0 IP from Rapid Silicon is positioned as a key component for enabling sophisticated FPGA designs tailored to meet modern technology demands. Its architecture is crafted to support the burgeoning needs of applications that require high degrees of data handling and processing accuracy, making it a preferred choice in the semiconductor industry.
StreamDSP's VITA 17.3 Serial FPDP Gen3 Solution is an advanced high-speed communication framework designed to meet the latest standards in data transfer technology. This solution offers improved data throughput and enhanced interoperability with existing systems, making it an invaluable asset for applications demanding the utmost precision and speed. Leveraging enhanced protocol designs, this IP solution integrates seamlessly with a broad array of FPGA platforms, providing users with unmatched performance and reliability in critical data communication setups. This makes it indispensable for applications in fields such as defense, scientific research, and real-time data processing.
The JESD204B Multi-Channel PHY is a versatile high-speed data interface designed to handle numerous channels simultaneously. Its architecture supports top speeds reaching 12.5Gbps, which is crucial in applications where data transfer efficiency and reliability are paramount. This technology is often employed in systems requiring high bandwidth and precision synchronization, making it ideal for advanced communication networks and high-resolution broadcasting environments. This product stands out for its capacity to neatly integrate with various semiconductor processes, ensuring seamless compatibility and broad functionality. Whether in complex signal processing or high-speed data acquisition contexts, it provides the necessary infrastructure to maintain robust data transmission with minimal latency and power consumption. Moreover, the JESD204B Multi-Channel PHY is designed to support multiple serial data rates, offering great flexibility to developers working within diverse technology applications. Its comprehensive design ensures that it meets the standards of modern digital systems, helping to push the envelope of data-transfer capabilities in state-of-the-art technological infrastructures.
The Photowave Optical Communications Hardware by Lightelligence is engineered for high-efficiency communication in disaggregated AI memory applications. Leveraging photonic technology, this hardware is compatible with the latest PCIe 5.0/6.0 and CXL 2.0/3.0 standards, featuring superior latency and energy efficiency. Photowave empowers data center managers to effectively manage and scale resources across server racks, ensuring optimal performance and scalability.<br> <br> This innovative hardware solution provides significant benefits by enabling quick, reliable data transmission with minimal energy consumption. It's particularly impactful in environments requiring large-scale data processing, such as AI computations and real-time data management. The integration of photonic elements not only enhances communication speed but also reduces operational costs by cutting down on energy use.<br> <br> Incorporating Photowave into infrastructures allows for exceptional versatility and operational efficiency. It is specifically designed for modern data architectures that demand robust connectivity and resource flexibility. With the challenges of scaling data center capabilities growing more complex, Photowave stands as an essential asset for maintaining competitive advantages in tech-forward industries.
The NuLink Die-to-Memory PHY is crafted to enhance communication between dies and memory components, addressing the bandwidth needs of modern computational systems. By employing both unidirectional and half-duplex bidirectional lanes, this PHY adapts to dynamic data traffic conditions, ensuring seamless data flow between processors and memory banks like HBM or DDR. It leverages standard packaging to offer cost-effective yet high-performing interfaces that meet demanding bandwidth requirements. NuLink for Die-to-Memory applications optimizes memory traffic through its bidirectional transceivers that enable fast directional switching, ensuring efficient memory utilization. This configuration enhances the exclusive beachfront bandwidth available for memory operations, effectively bridging the bandwidth gap experienced in standard packaging solutions. Enabling scalability, the PHY facilitates the integration of large-scale HBM configurations in standard packages, a critical factor for AI and machine learning applications, where memory access speed dictates overall computational efficiency.
The Chiplet Interface solutions provided by Neuron IP include cutting-edge PHY & D2D Adapter IP for chiplet products. These solutions are built around the latest UCIe v1.1 specification and are designed to support a wide range of application verticals. They are well-known for their unparalleled PPA-differentiated architecture, which includes 32Gbps UCIe-Advanced and Standard cores. These interfaces are set to revolutionize the way microprocessors work in ultra-low latency environments, enhancing both performance and efficiency.
The ePHY-5607 by eTopus is a versatile SerDes component operating at data rates between 1 to 56 Gbps, optimized for power, performance, and area (PPA) in a 7nm process environment. These features make it exceptionally suitable for modern data centers and AI applications, where space and energy efficiency are paramount. This component boasts superior BER and rapid Clock Data Recovery (CDR), ideal for high-speed optical and electrical interfaces. Its robust architecture is designed to minimize temperature-induced performance variations, which is crucial in maintaining consistent performance in data-dense environments. The ePHY-5607 enables scalable insertion loss, ensuring it can accommodate varying signal degradation scenarios in infrastructure deployments. Applications for the ePHY-5607 span enterprise networking and high-performance computing, addressing the critical needs for reduced latency and improved signal integrity.
Glasswing provides a revolutionary approach to semiconductor chip-to-chip connectivity using the proprietary CNRZ-5 Chord Signaling. This PHY solution enables unparalleled flexibility and efficiency, thanks to its ability to double bandwidth while reducing power consumption compared to traditional signaling methods. The Glasswing architecture supports ultra-short range SerDes with high throughput, optimized for a myriad of applications from data centers to consumer electronics. By sending five bits of data over six wires simultaneously, the power and cost efficiency is markedly improved while maintaining throughput capabilities reaching 500 Gbits/s per pin. Glasswing is also celebrated for its advanced signal diagnostics and adaptability, making it capable of supporting complex designs without sacrificing performance. It is particularly suited for high-performance computing and AI workloads, providing substantial power savings and heightened reliability.
The VITA 17.1 Serial FPDP Solution from StreamDSP is designed for high-speed data transfer applications. This solution leverages industry-standard interfaces to facilitate efficient serial data communications, ensuring seamless data flow in demanding environments. It's ideal for applications that require robust data integrity and low-latency transmission, making it a perfect fit for military and aerospace operations. By supporting a range of configurations and offering flexibility in integration, this solution helps address specific user needs while maintaining compatibility with widely used FPGA devices.
Dyumnin Semiconductors has developed a versatile Interconnect Generator, designed to offer a protocol-agnostic interconnection solution for integrating AXI and OCP master and slave architectures. This generator is notable for its ability to support various interconnect topologies such as Simple, Pipelined, and Crossbar. A key feature of this interconnect system is its flexibility in handling different protocol behaviors, ranging from atomic request-response scenarios to complex split transactions with independent address and data phases. An essential component of this system is the integrated reorder buffer with configurable depth. This feature allows multiple outstanding requests to be managed efficiently, ensuring that data is delivered in the correct order even when multiple transactions are processed concurrently. This capability is crucial in complex systems where maintaining data integrity is a priority, and it significantly enhances system performance by optimizing data flow. The Interconnect Generator's flexibility and high configurability make it suitable for a wide range of applications, from small embedded systems to large-scale networking infrastructure. By providing robust support for essential interconnect tasks, this generator helps streamline the development of complex systems, ensuring high efficiency and reliability in data communication.
Teletrx's MIPI C-PHY Interface is designed to enhance data transmission in mobile and multimedia applications by enabling robust high-speed data connections. With support for the latest MIPI standards, it facilitates effective communication between various integrated circuits within a modern device.
The FireCore PHY & Link Layer Solutions encompass a range of synthesizable IP cores targeted at the IEEE-1394b-2008 and AS5643 standards. These solutions combine link and physical layers into a cohesive package aimed at ensuring seamless data transmission and high-speed communication across avionics networks. Featuring capabilities for bit error injection and comprehensive bit error rate testing, the FireCore solutions facilitate precise system diagnostics and maintenance. They are designed to support S100 to S3200 data transfer speeds, addressing industry demands for rapid and reliable data throughput. This adaptability makes them a suitable choice for diverse aerospace applications requiring robust data handling capabilities. Incorporating advanced patented technologies, FireCore solutions improve bus management through features such as expanded hardware filtering and enhanced isochronous data streaming. These tools are indispensable in supporting reliable and efficient data processing in contemporary avionics systems, contributing significantly to the stability and performance of aerospace communication networks.
The Evo Gen 5 PCIe Card is crafted for the next generation of AI inferencing, focusing on advancing the capabilities of deep learning models. Designed to provide high performance inferences, this PCIe card leverages Gen 5 technology to deliver faster data throughput and improved energy efficiency. The Evo Gen 5's capabilities are well-suited for demanding computational tasks found in modern AI applications, offering an elevated level of integration and performance. Engineered to optimize AI frameworks, the Evo Gen 5 PCIe Card ensures a seamless blend with existing hardware setups, reducing downtime and promoting operational continuity. Its robust architecture allows it to handle the intricate requirements of large-scale neural network models with ease, making it an indispensable tool for sectors relying heavily on AI inference. With its state-of-the-art design, the Evo Gen 5 PCIe Card supports diverse workloads, ensuring high adaptability across various AI landscapes. Businesses focused on AI innovation will find this card instrumental in maintaining a competitive edge, thanks to its blend of speed, reliability, and efficiency.
The Prodigy FPGA-Based Emulator by Tachyum offers a versatile platform for testing and evaluating the performance of their universal processors. This hardware emulator uses multiple FPGA and IO boards, networked within a rack configuration, providing a comprehensive environment for performance measurement and debugging. It supports product evaluation at scale, giving users the ability to test and develop applications efficiently. Designed to emulate full processor cores, each board in the system includes vector and matrix fixed and floating-point processing units, ensuring that a wide variety of computational tasks can be accurately simulated. The architecture of the emulator is particularly beneficial for organizations needing to assess software development and compatibility testing across various hardware configurations. Tachyum’s emulator system becomes an invaluable asset for enterprises planning to integrate Prodigy processors into their infrastructure by providing a low-cost, low-risk evaluation method. This platform aids partners and developers in understanding how Prodigy's unique processor capabilities can be fully exploited in real-world applications, thereby facilitating a smoother transition from existing architectures to Tachyum’s advanced computing solutions.
Built for robust performance, Aragio's high-speed LVDS solutions address the needs for low power, high data rate communication interfaces in semiconductor designs. Featuring a three-module design—comprising input, output, and reference blocks—these LVDS I/Os cater to operations up to 1 GHz for drivers and 1.2 GHz for receivers, supporting finer technologies for optimal performance. The design operates efficiently with I/O powered at 1.8V and core supply levels from 1.0V to 1.1V, ensuring low power consumption while achieving high-speed operation. The LVDS meets the IEEE standard 1596.3-1996 for low voltage differential signaling, a testament to its reliability and robustness in communication protocols. Furthermore, these designs offer low power consumption with low differential skew and high common mode voltage ranges, critical for maintaining signal integrity. Supporting nodes from 130nm down to advanced nodes like 16nm, this solution guarantees broader applicability and integration into numerous system architectures, offering designers flexibility and scalability in high-speed data processing tasks.
AresCORE, a leading UCIe Die-to-Die PHY, is designed to establish high-bandwidth and low-latency connections between silicon dies within a single package. This PHY caters specifically to the growing interconnect demands of modern system architectures where multiple dies work cohesively. AresCORE ensures efficient data transfer across die boundaries, vital for high-performance computing tasks and data-intensive applications.\n\nThis innovative PHY maintains low power consumption while providing robust performance metrics. It supports universal connectivity standards, making it a versatile option for a range of devices and applications that involve die-to-die interaction. By leveraging this PHY, manufacturers can ensure that their multi-chip solutions remain at the cutting edge of technology trends, providing unparalleled speed and efficiency.\n\nAresCORE's architecture is optimized for contemporary packaging technologies, effectively handling high data rates while mitigating latency issues. This makes it indispensable for applications such as AI, data centers, and next-generation computing paradigms where rapid and reliable inter-chip communications are non-negotiable.
The Regli PCIe retimer from Kandou is designed to ensure low-latency and high-integrity data transmission for PCIe networks. Operating with latency under 10 nanoseconds and featuring an impressive error rate of up to 1E-12, it offers exceptional performance for data-intensive applications. The retimer supports PCIe 5.0 with speeds up to 32 GT/s and provides robust signal integrity across x16/x8/x4 bidirectional lanes. Its CXL 2.0 compatibility further enhances the system's reach and flexibility, allowing for an extended range without compromising on latency. The Regli is ideal for use in servers, workstations, 5G infrastructure, and high-speed networking applications. Key features also include secure boot, on-chip diagnostics, and multiple control interfaces, simplifying the design process. Power management is optimized with flexible voltage options, including 0.9V, 1.2V/1.5V, and 1.8V, to suit various system requirements. The compact dimensions and advanced diagnostic capabilities make it a preferred choice for system designers seeking reliability and performance in PCIe and CXL environments.
Sofics has verified its TakeCharge ESD protection clamps on technology nodes between 0.25um CMOS down to 3nm across various fabs and foundries. The ESD clamps are silicon and product proven in more than 5000 mass produced IC-products. The cells provide competitive advantage through improved yield, reduced silicon footprint and enable low-leakage, high-speed or high voltage tolerant interfaces. The ESD protection described in this document can be used for 1.6V chiplet (die-2-die) interface pads in the GF 22nm FDX technology. The ESD robustness is strongly reduced in order to reduce the size and capacitance.
The 5G ORAN Base Station IP is designed to revolutionize the mobile networking industry by significantly increasing wireless data capacity and offering new opportunities for various wireless applications. As 5G technology advances, this IP enables enhanced connectivity, supporting the massive throughput requirements necessitated by the increasing demand for high-speed internet and data transfer. It supports interoperability with current and future network infrastructures, ensuring a seamless transition to next-generation technologies. This IP integrates advanced antenna technologies to support multiple input, multiple output (MIMO) systems, thus contributing to improved spectral efficiency. The 5G ORAN Base Station is optimized for assorted use cases, from urban high-density environments to rural locales, facilitating expansive mobile coverage while meeting the rigorous demands of modern telecommunication standards. As a result, it functions effectively across varied geographical and operational conditions. The implementation of this IP within telecommunications infrastructure promises reduced latency and increased reliability of wireless communications, paving the way for innovative applications in smart cities, autonomous vehicles, and real-time video streaming. Overall, the 5G ORAN Base Station IP serves as a comprehensive solution for building scalable and future-proof mobile networks.
GammaCORE is an advanced UCIe Die-to-Die Controller that implements the latest UCIe 2.0 specification, making it fit for high-density die interconnects in demanding applications. This controller is equipped to handle data-intensive environments like data centers and AI frameworks, where seamless die-to-die communication is pivotal.\n\nThis solution is highly customizable, offering configuration options that allow it to meet specific application requirements with optimal performance, latency, and surface area usage. It integrates seamlessly with other chiplet components, offering a cohesive and robust die-to-die communication framework that minimizes bottlenecks and maximizes throughput.\n\nGammaCORE's capabilities ensure efficient and comprehensive inter-die communication, crucial for the performance and functionality of complex system architectures. Its robust design, paired with support for UCIe Streaming Protocol applications, enables it to cater to a wide spectrum of computational and high-speed data transfer needs, enhancing overall system effectiveness.
The SerDes (Serializer/Deserializer) IP from Actt is a crucial technology enabling high-speed data transfer between integrated circuits over short and long distances, supporting interface protocols such as USB, PCIe, and SATA. This IP is crucial for industries requiring rapid data processing and transmission, such as telecommunications and computer systems. Engineered to optimize signal integrity and significantly reduce signal degradation, Actt's SerDes IP facilitates efficient data serialization and deserialization. This feature ensures data integrity over various interfaces, regardless of the complexity of the systems involved. With the dynamic architectural demands of contemporary digital circuits, the SerDes IP is adaptable, addressing both current and future connectivity needs. It’s scalable, allowing integration into complex circuit designs seamlessly, meeting the high data rates demanded by modern networking and computing equipment.
The Automotive Multigigabit Ethernet Switch with Multilayer Security is an advanced networking solution designed to meet the rigorous demands of modern automotive systems. Incorporating high-speed data transfer capabilities and robust security features, this switch facilitates seamless connectivity across vehicle networks. Its multigigabit capability ensures that it can handle today’s data-heavy applications ranging from infotainment to advanced driver-assistance systems (ADAS). Security is a cornerstone of this switch's design, featuring multilayer protection that guards against unauthorized access and data breaches, which are critical in automotive applications. The switch’s architecture is optimized for low latency and high robustness, ensuring seamless integration with various automotive-grade Ethernet interfaces, thereby enhancing the overall vehicular communication system. Additionally, the switch offers scalability options that support future upgrades and technology integrations, making it a forward-compatible platform. Its compliance with industry standards guarantees interoperability and reliability across various automotive applications, further enhancing its appeal to manufacturers looking for dependable long-term solutions for in-vehicle networking.
The CXL 3.1 Controller from Panmnesia stands out for its groundbreaking sub-two digit nanosecond latency, facilitating efficient memory expansion across various server types. The controller's streamlined operations significantly reduce the latency compared to conventional methods, proving advantageous for AI services that require rapid data access and processing. Its capacity to link multiple devices in a unified memory space makes it essential for expansive cloud computing and AI applications.
The ChipBridge AXI4 Connectivity solution from ALSE is a strategic IP designed to efficiently map AXI4 interfaces to external FPGAs. This allows a master FPGA or ASIC to access peripherals located on a slave FPGA, significantly enhancing system design flexibility. Utilizing a simple transceiver setup, ChipBridge extends the AXI4 protocol's capabilities beyond a single chip, thereby providing an innovative approach to connecting and controlling external peripherals with minimal latency. ChipBridge's adaptability to various FPGA environments, particularly Lattice CertusPro-NX and other high-speed transceiver-equipped devices, underscores its versatility. The IP maintains robust communication integrity and efficiency, integrated seamlessly via a physical link such as LVDS or Aurora Light protocols. This configuration facilitates efficient data handling while minimizing the influence of electrical and safety concerns typically associated with chip interconnects. This IP is a highly effective solution for systems requiring extensive peripheral connectivity while keeping master FPGA designs simple and cost-effective. ChipBridge's resource-friendly approach and compatibility across FPGA platforms make it suitable for numerous applications, including those in industrial, automotive, and telecommunication domains, where robustness and low overhead are critical.
Global Unichip Corp.'s Die-to-Die (2.5D/3D) IP offers a sophisticated solution for high-speed interconnects between dies in both 2.5D and 3D configurations. This technology is key to enhancing the performance of complex systems by providing high-bandwidth, low-latency communications between chips. Integrating seamlessly with existing CoWoS(R) and similar packaging technologies, the Die-to-Die IP is optimized for xPU applications and high-performance computing. Its design ensures signal integrity and efficient power delivery, which are crucial for advanced computing solutions relying on multiple chip interconnects.
ALSE's Aurora 64B/66B Core is a highly optimized implementation of the Aurora protocol for high-speed, chip-to-chip communication using transceivers. It is suitable for applications that demand efficient data transmission across multiple lanes, achieving an effective bandwidth of up to 97%. This IP core ensures full compatibility with high-end FPGAs from Intel, Lattice, and Microchip, as well as complete interoperability with Xilinx's Aurora core, making it a versatile choice for diverse integration scenarios. The 64B/66B protocol is renowned for its efficiency over the older 8B/10B encoding, providing almost lossless data transfer and supporting extremely high lane speeds. The ALSE implementation adheres to these standards while remaining compact and resource-efficient. Its robust feature set includes duplex and simplex operations, native flow control, and support for up to 16 transceiver lanes per instance, aligning with demanding industrial, automotive, and telecommunication applications. Beyond its flexibility, the Aurora 64B/66B core's efficient flow control and data handling capabilities make it an ideal solution for environments requiring synchronized communications and high-speed data processing. Its design ensures minimal latency and overhead, optimizing system performance and reliability in applications ranging from high-speed networks to advanced sensor integration.
The CoaXPress Device & Host IP suite by EASii IC is designed for high-speed imaging applications, offering comprehensive solutions compliant with both CoaXPress 1.1.1 and 2.0 standards. These IP blocks are optimized for integration into FPGA architectures, enabling efficient transmission and reception of video data streams. The IP suite supports dynamic reconfiguration, providing flexible system design for various industrial, medical, and defense imaging purposes. Through this, users gain the ability to manage multiple cameras efficiently, ensuring high data throughput and robust error handling capabilities.
The Aurora 8B/10B Core by ALSE is engineered for high-speed, low-latency serial data transmission in FPGA-based systems. This IP core utilizes the Aurora 8B/10B protocol, known for its reliability and efficiency in applications requiring stable data exchanges across transceiver links. Leveraging full interoperability with Xilinx's Aurora IP, it supports a broad range of FPGA family integrations, including Altera/Intel, Lattice, and Microchip. Capable of handling bitrates up to 6.6 Gbps per transceiver lane, the Aurora 8B/10B Core is tailored for scenarios demanding high-speed serial connectivity devoid of complex overhead. It offers flexible configuration options, supporting full-duplex, simplex Tx, and Rx operations to meet diverse design needs. Users benefit from features like native flow control, clock compensation, and additional CRC for data frame integrity, enhancing the robustness and reliability of data transmission. This core is a preferred choice for professionals implementing interconnects like sensor arrays, real-time control systems, and high-speed telemetry, where consistency and performance are paramount. Its compact architecture ensures minimized FPGA resource utilization, promoting cost-effective deployment across various high-performance FPGA applications.
The JESD204 IP from ALSE is designed to facilitate high-speed data conversion processes in FPGA environments. This standard, established by the JEDEC committee, integrates seamlessly with FPGAs to efficiently handle high-speed ADC and DAC interfaces. By utilizing transceivers for serial data transfer, the JESD204 IP enables precise data positioning and time synchronization, crucial in applications involving multiple analog-to-digital and digital-to-analog conversions. As a cornerstone for communication in high-performance applications, JESD204 supports various versions like JESD204B and JESD204C, each enhancing speed and protocol efficiency further. The IP core simplifies the complexities associated with synchronization and latency issues prevalent in high-speed data processing systems, making it an invaluable asset for designers working with cutting-edge data converter technologies. Its capability to manage data streams seamlessly aligns with the requirements of modern industrial and communication systems. By delivering robust performance even at extreme speeds, the JESD204 IP ensures that sophisticated signal processing tasks are managed with precision and reliability, aligning with the evolving needs of sectors reliant on advanced data acquisition and processing technologies.
Atria Logic has developed a comprehensive PCIe Gen1/2 PHY supporting data transfer rates of 2.5GT/s and 5GT/s, fully compliant with the PCI-SIG v2.0 standards. This PHY core, optimized for robust performance, supports multiple widths (8, 16, 32-bit) interfacing, ensuring flexibility according to system requirements. The PCIe PHY efficiently executes low-latency and high-throughput data transactions, maintaining synchronization with Transaction Layer State Machine (LTSSM) protocols. It is engineered with a state-of-the-art proprietary architecture that includes elastic buffer management, scrambler support, and reliable recovery of data. Perfect for high-demand applications like server and networking interfaces, the PCIe PHY ensures precision in data integrity and thorough compliance with electrical signaling standards. The highly adaptable design makes it ideal for embedded system integrations, supporting various degrees of control over data transfers in demanding technological environments.
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